Basic Info.
Type
Combining Rigid Circuit Board
Material
Fiberglass Epoxy Resin + Polyimide Resin
Application
Communication
Flame Retardant Properties
V0
Processing Technology
Electrolytic Foil
Insulation Materials
Epoxy Resin
Impedance
Impedance Control
Transport Package
by Vacuum Packing in Cartons
Specification
160*60mm/14
Product Description
| Capabilities-FPC |
| N0 | Items | Parameter | N0 | Items | Parameter |
| 1 | Layers Counts | FPC:2-6L RFPC:2-10L | 14 | Min.inner design line width/clearance | T/TOZ 1.6mil/1.6min(0.04mm/0.04mm)
H/HOZ 2.0mil/2.0min(0.05mm/0.05mm)
1/1OZ 3mil/3min(0.075mm/0.05mm) |
| 2 | Max Fabrication area | 19.7"×19.7" (500mm×500mm) | 15 |
| 3 | Major material brands | Doosan\Thinflex\Shengyi\Taiyo\DongYi | 16 |
| 4 | Finished board thickness tolerance | ±10%
±0.03mm (Board thickness≤0.2mm)
±0.05mm(Board thickness≤0.5mm | 17 | Min. external design line width/clearance | T/TOZ 2.0mil/2.0min(0.05mm/0.05mm)
H/HOZ 3.0mil/3.0min(0.075mm/0.075mm)
1/1OZ 4.0mil/4.0min(0.1mm/0.1mm) |
| 5 | Separated layer structure/buried and blinded via hole | YES | 18 |
| 6 | Min hole diameter | Machanical drilling size:0.1mm~6.5mm Laser drilling size:0.1-0.125mm | 19 | Min.solder mask dam width | 2.5mil(0.064mm) |
| 7 | Base copper thickness of outer | 1/3 OZ-1OZ (0.012mm-0.035mm) | 20 | Soldermask registration tolerance | ±2mil(±0.05mm) |
| 8 | Base copper thickness of inner | 1/3 OZ-1OZ (0.012mm-0.035mm) | 21 | Min. coverlay dam width | 8mil(0.2mm) |
| 9 | Board thickness | 0.07-2.0mm | 22 | Coverlay registration tolerance | ±6mil(±0.15mm) |
| 10 | Max hole plating Aspect ratio | 8:01 | 23 | Min. routing tolerance(hole-edge)(min)) | ±4mil(±0.1mm) |
| 11 | Hole Size Tolerance (PTH) | ±3mil(±0.075mm) | 24 | Min test ability | PAD Size min(0.1mm) PAD Pitch min(0.4mm) |
| 12 | Hole Size Tolerance (NPTH) | ±1mil(±0.025mm) | 25 | Reinforcement type | PI\FR4\SUS |
| 13 | Hole wall copper thickness | 10um min or on the basis of customer's requestment | 26 | Electro-magnetic shielding process | Electro-magnetic shielding film/Silver past silkscreen printing |
| | | | | | |
| Capabilities-PCB |
| N0 | Items | Parameter | N0 | Items | Parameter |
| 1 | Layers Counts | 2-26L | 14 | Min.inner design line width/clearance | H/HOZ 2.0mil/2.0min
1/1OZ 2mil/2min
2/2OZ 3mil/3min
3/3OZ 3mil/3min |
| 2 | Max Fabrication area | 21.5"×24.5" (700mm×700mm) | 15 |
| 3 | Material | FR4(130ºCTg-180CTg),CM3,Halogen-free | 16 |
| 4 | Finished board thickness tolerance | ±10%
±3 mil(thickness≤0.8mm)Board Thickness≤0.8mm
±0.05mm(thickness<thickness≤0.5mm | 17 | Min. external design line width/clearance | H/HOZ 2.0mil/2.0min
1/1OZ 2mil/2min
2/2OZ 3mil/3min
3/3OZ 4mil/4min |
| 5 | Min bendability | ≤0.7% | 18 |
| 6 | Drillig hole diameter | 0.005"~0.255" (0.15mm-6.5mm) | 19 | Min.solder mask dam width | 2.0mil |
| 7 | Base copper thickness of outer | 1/3 OZ-8OZ | 20 | Soldermask registration tolerance | ±4mil(±0.101mm) |
| 8 | Base copper thickness of inner | 1/2 OZ-8OZ | 21 | Solder rmask hardness | >6H |
| 9 | Board thickness | 0.3-6.0mm | 22 | Thermal shock | 288ºC 10second (3times) |
| 10 | Max.hole plating Aspect ratio | 10:01 | 23 | Ionic cleanliness test | <1.56ug/cm2(NaCI) |
| 11 | Hole Size Tolerance (PTH) | ±3mil(±0.075mm) | 24 | Peel strength | ≥1.4N/mm |
| 12 | Hole Size Tolerance (NPTH) | ±1mil(±0.025mm) | 25 | Characteristic impedance control | ±8% |
| 13 | Hole wall copper thickness | ≥0.8min(≥0.020mm) | 26 | Surface finishIing | OSP,Immersion gold,Lead-free HASL,Plating gold,Carbon ink ,Peelable solder mask ink ect. |
| Product delivery capability | | | | | | |
| Layers | Through-Hole 2-4L | First Order HDI | Second Order HDI | Third Order HDI |
|
| Area | 4-8L | 10-14L | 4-8L | 10-14L | 16-18L | 6-8L | 10-14L | 16-18L | 8-10L | 12-14L | 16-18L |
| ≤0.3M2 | 9-12 Days | 13-15 | 12-15 | 16-17 | 18-20 | 14-16 | 17-19 | 20-22 | 16-18 | 19-21 | 22-24 |
| 0.3-3M2 | 10-13 Days | 14-16 | 13-16 | 17-18 | 19-21 | 15-17 | 18-20 | 21-23 | 17-19 | 20-22 | 23-25 |
| 3-10M2 | 11-14 Days | 15-17 | 14-17 | 18-19 | 20-22 | 16-18 | 19-21 | 22-24 | 18-20 | 21-23 | 24-26 |
| >10M2 | 14-16 Days | 17-19 | 20-22 | 23-25 | 26-28 | 21-23 | 24-26 | 27-30 | 25-28 | 30-35 | 35-40 |
2.The common plate FR4 is the standard material;
3.Standard board thickness :0.6mm-1.6mm;
4.Standard copper thickness :12um-35um;
5.Standard copper thickness line width/spacing≥0.061mm;
6.Surface treatment:OSP,Electroless nickel immersion gold,OSP+ENIG;
7.Delivery day shall be confirmed by EQ,and counted from the date of material in stock;
8.The delivery time depends on low and peak seasons;
9.The delivery cycle of special meterial or special process ,please consult customer service;
10.Consulting customer service if requirements beyond the regular delivery cycle;ProductProduct DistributionCompany Introduction Established in 2017, Ant Universal (ShenZhen) Electronics Co., Ltd is a professional manufacturing enterprise, it integrates design, processing, sales and foreign trade. At present, we have set up two manufacturing bases in Shenzhen and Dongguan area, which including three PCB business departments ,one PCBA division and one EMS division.Our main products range from single to multilayer rigid, flex and rigid-flex board with microwave, high-frequency and heavy copper feature; as well as customized PCB with special performance which are widely used in high-tech fields including communication, industrial control, power electronics, medical device, security electronics, Aerospace ,defense and military industry, etc
Start from establishment, Ant Universal Electronics continuously upgrading and expanding our R&D ability, production facilities and operational management. Actively Promoting One-stop Service Model of "Design-Manufacture-SMT Patch", shortens the R&D, pilot test and manufacturing time, hence reduces costs effectively.
Relying on superior quality products and services that consistently meet and exceed our customer's requirement, we strive to become the leading "one-stop service supplier" platform for electronic industry.
Factory
FAQ
Q1: How do you make sure the quality?
•:Our Product is all 100% tested including Flying Probe Test (for sample), E-test (mass) or AOI.
Q2.What do I need to offer for production?
•Quantity, Gerber file and Technic requirements(material,surface finish treatment, copper thickness,board thickness ,...)
Q3. What file formats do you accept for production?
•Gerber file: CAM350 RS274X
•PCB file: Protel 99SE
Q4.Are my PCB files safe when I submit them to you for manufacturing?
•We respect customer's copyright and will never manufacture PCB for someone else with your files unless we receive written. Permission from you, nor we'll share these files with any other 3rd parties.
Address:
7th floor, buildingC, no6 industrial avenue, tangwei community, fuhai street, baoan district, shenzhen city, guangdong province
Business Type:
Manufacturer/Factory
Business Range:
Auto, Motorcycle Parts & Accessories, Computer Products, Consumer Electronics, Electrical & Electronics, Furniture, Health & Medicine, Industrial Equipment & Components, Lights & Lighting, Security & Protection, Tools & Hardware
Management System Certification:
ISO 9001, ISO 14001, IATF16949
Company Introduction:
Established in 2017, Ant Universal (ShenZhen) Electronics Co., Ltd is a professional manufacturing enterprise, it integrates design, processing, sales and foreign trade. At present, we have set up two manufacturing bases in Shenzhen and Dongguan area, which including three PCB business departments, one PCBA division and one EMS division.
Our main products range from single to multilayer rigid, flex and rigid-flex board with microwave, high-frequency and heavy copper feature; As well as customized PCB with special performance which are widely used in high-tech fields including communication, industrial control, power electronics, medical device, security electronics, Aerospace, defense and military industry, etc
Start from establishment, Ant Universal Electronics continuously upgrading and expanding our R&D ability, production facilities and operational management. Actively Promoting One-stop Service Model of "Design-Manufacture-SMT Patch", shortens the R&D, pilot test and manufacturing time, hence reduces costs effectively.
Relying on superior quality products and services that consistently meet and exceed our customer′s requirement, we strive to become the leading "one-stop service supplier" platform for electronic industry.
